Samuel Chiu, Applied Materials, Taiwan
“Material Innovations and Challenges of Thin Films and Plasma Applications for 3 nm Node and Beyond”
Tuesday, May 21, 2024, 11:00 a.m.
The inventions of integrated circuits (1958) and the prediction of Moore’s Law (1965) will celebrate their 66th and 59th anniversaries in 2024, respectively. The foundation of the semiconductor industry and its amazing achievement have dramatically changed the way we live.
With the advents of Artificial Intelligence (AI), Machine Learning, and AR/VR (Artificial Reality, Virtual Reality) applications enabled by advanced semiconductor technology, there are high hopes we will see significant breakthroughs in many areas such as vaccine research, auto-pilot, astrophysics, and supercomputing, etc.
Taiwan has played a critical role as a hub of semiconductor R&D and manufacturing for the past several decades. In this presentation, the latest innovation of thin film materials and plasma-related processes to drive the success of advanced technology nodes will be described. Furthermore, the future challenges and opportunities beyond 3nm nodes in order to keep Moore’s Law alive will also be presented.