Manuscript Deadline: July 15, 2024
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Lecture Series: Exhibitors Keynote

Samuel Chiu, Applied Materials, Taiwan

“Material Innovations and Challenges of Thin Films and Plasma Applications for 3 nm Node and Beyond”

Tuesday, May 21, 2024, 11:00 a.m.

The inventions of integrated circuits (1958) and the prediction of Moore’s Law (1965) will celebrate their 66th and 59th anniversaries in 2024, respectively. The foundation of the semiconductor industry and its amazing achievement have dramatically changed the way we live.

With the advents of Artificial Intelligence (AI), Machine Learning, and AR/VR (Artificial Reality, Virtual Reality) applications enabled by advanced semiconductor technology, there are high hopes we will see significant breakthroughs in many areas such as vaccine research, auto-pilot, astrophysics, and supercomputing, etc.

Taiwan has played a critical role as a hub of semiconductor R&D and manufacturing for the past several decades. In this presentation, the latest innovation of thin film materials and plasma-related processes to drive the success of advanced technology nodes will be described. Furthermore, the future challenges and opportunities beyond 3nm nodes in order to keep Moore’s Law alive will also be presented.

Biography

Dr. Samuel Chiu is Senior Technical Director in Applied Materials. He is in charge of RD advanced nodes engagement and High-volume manufacturing (HVM) support with Taiwan’s most strategic customer. In his past capacities, he had managed a product team in TSMC account, had an expatriate assignment in Singapore to lead the UMCi 90nm project, and served as program manager of AMAT-TSMC 300mm pilot line project to help build up Taiwan’s first 300mm fab.

He also had foundries experience as director of Supplier Quality Engineering (SQE) in GlobalFoundries from 2010 to 2012; and Thin-film and Diffusion RD manager in Worldwide Semiconductor Manufacturing Company (WSMC, later acquired by TSMC in 2000), for 0.18um logic technology transfer.

He currently serves as Vice Chair of the IC Committee in SEMI Taiwan; and has multiple patents, technical publications, and invited conference talks. Dr. Chiu holds a Ph.D. in Materials Science and Engineering from the University of California, Los Angeles (UCLA), and a Bachelor’s degree from the National Taiwan University (NTU). He also graduated from Executive General Management Program (eGMP) at the National University of Singapore (NUS).

Key Dates

Awards Nomination Deadline:
November 15, 2023

Author Notifications:
December 18, 2023

Late News Abstract Deadline:
February 22, 2024

Early Registration Deadline:
April 4, 2024

Housing Deadline:
April 4, 2024

Manuscript Deadline:
July 15, 2024

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Yvonne Towse

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